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 Last update at 4 June 2007

Capabilities

 
Single Sided Prototype & mid volume (<1000 pcs)
Double Sided  Prototype & small volume (<500 pcs)
Multilayer Prototype only (<10 pcs)
Soldermask Dry film or LPI applied as SMOBC.
Legend Print  LPI, Screen Print (white epoxy)
Surface Finishing Electroless copper, Electroless nickel, Immersion Gold, Electroless Nickel Immersion Gold (ENIG).
Lead Free finish proprietary process. 
Processes 12 mils, 10 mils, 5 mils, 2 mils*
Copper Thickness No limit, dependent upon trace width
Photoplotting 8000 DPI , up to 30"x42" Infra-red Film
Repeatability -Imaging 1/10 th mil
Repeatability -Drill ±1 mil X and Y axis
Repeatability - Routing ±10 mils
Top/bottom alignment ± 2 mils
Dimensional Accuracy ±0.001% on X axis (1/100,000 mil)
±0.1% x on Y axis (1/1000 mil)
*Proprietary Full Addictive Process

Listed above is our standard capabilities. We are also in the R&D stage of more advanced capabilities like 2mil trace/separation as well as very fine 10 oz boards.

Machineries

We have a complete set of PCB fabrication machineries. These machineries are specially designed for small volume fabrication requirements. As we strive to achieve better standards, we are constantly adding more equipment to our list. 

Type Model Manufacturer
CNC Drill CCD MTC Bungard, Germany
CNC Router XenPCB Xenon, Cypruss
Photoplotter Avantra 30  Agfa, Belgium
Spray Etcher Jet34D XXL Bungard, Germany
Spray Developer Jet34D Ver 2 Bungard, Germany
UV exposure Hellas Bungard, Germany
PTH System FlashPlate Custom PCB, Malaysia
Brushing Machine Vac-Srub Custom PCB, Malaysia
Laminator NE 2320 Han Kook, Korea
Shears MS-6 Kepro Circuits, USA
Infra-Red Curing BTO-102 Kepro Circuits, USA

 

Typical Process Outline


This is our normal process cycle - we can alter the process cycle according to product requirement (eg. Gold Finish). These all detailed steps  ensures highest quality PCB with low reject rates.

1. Drilling 15. Laminate Surface Etch
2. Deburring 16. Soldermask Application
3. Desmear 17. Soldermask Oven Cure
4. Micro-etch 18. Soldermask Exposure
5. Sensitizing 19. Spray developing
6. Activating 20. Soldermask Hardening
7. Plated Through Hole 21. Silkscreen Application
8. Photoresist Lamination 22. Silkscreen Oven Cure
9. Photoresist Exposure 23. Silkscreen Exposure
10. Spray  Developing 24. Spray developing
11. Spray Etching 25. Silkscreen Hardening
12. Spray Stripping 26. Copper Pads cleaning
13. Anti-Tarnish Bath 27. Immersion Tin/Silver
14. Surface Cleaning 28. Panel routing.

Chemicals & Supplies

 
Type Function Manufacturer
Drill Bits Drilling HAM, Germany
Infrared Films Photoplot Master Kodak, USA
OrthoLith  FIlms Negative Duplicates Kodak, USA
Diazo Films Positive Duplicates Aazon, USA
Soldermask Dry Film Soldermask Dupont, USA
Photoresist  Dry Film Photoresist Dupont, USA
Soldermask LPI Soldermask Fotochem, Taiwan
Soldemask Dry Film Soldermask Shipley Ronal
Laminates FR4, FR1, CEM-1. Nanmei, China
Laminates FR4-2, FR2, CEM-2 Kingboard, Taiwan
Electroless Copper Copper Plating Custom PCB Labs
Electroless Nickel Nickel Plating Custom PCB Labs
Electroless Gold Gold Plating Custom PCB Labs
Immersion Tin  Tin Plating Custom PCB Labs
Immersion Silver Silver Plating Custom PCB Labs
Surface Activation Through Hole Plating Custom PCB Labs
Electroless Control Electroless Metal  Deposition Custom PCB Labs

Custom PCB Labs is our very own R&D department specializing in metal finishing chemicals. We are a handful of chemically self-sufficient manufacturers in this industry 

Suppliers 

 
Supply Type Supplier
Industrial Chemicals KLH Chemicals, Malaysia
Industrial Chemicals Prima Chemicals, Malaysia
R&D Lab Supplies Chemolab Supplies, Malaysia
Copper Clad Laminates Nanmei Technologies, Malaysia
Fabrication Consumables Bungard, Germany

 

 

 

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All questions should be directed to sales@custompcb.com